EMS
Electronic Manufacturing Services
We provide customized EMS services based on a manufacturing process connecting circuit design, SMT assembly, production, material operations, and quality response.
EMS Service Configuration
Major operational areas — from design and production to manufacturing innovation, materials, and quality management — organized by panel.
R&D
An EMS technology solution providing integrated support for circuit design, R&D, and simulation verification.
Advanced Engineering Solutions
EMS Technology
E2S is an integrated engineering partner supporting the entire product development process — from planning, R&D, PCB design, and simulation verification through production handoff. We provide optimal solutions based on accumulated technical expertise.
We provide EMS services specialized in high-reliability industrial and automotive electronics. The full process — PCB Artwork, simulation, component sourcing, SMT manufacturing, and final assembly inspection — is managed based on the IATF 16949 quality system.
Solder Paste Printing
Solder Paste Precision Printing
Placement
High-speed & Mixed Component Mounting
Reflow Soldering
Nitrogen (N2) Reflow Process
AOI & X-Ray Inspection
3D Inspection & Defect Detection
FCT & Packing
Functional Test (FCT) & Shipping
AP & Memory Ref. Board
RF & Automotive
FPGA/SoC Test Board
Simulation(SI/PI)
Simulation
Pre-simulation enables design optimization, reducing development time and cost.
EMS Business
PCB Simulation Service
Pre-simulation enables design optimization, reducing development time and cost.
EMI
Electromagnetic Interference: EM Noise Analysis and Optimization
SI
Signal Integrity: High-Speed Signal Transmission Distortion Analysis
PI
Power Integrity: Power Distribution Network Noise and Impedance Analysis
EMI: EM Noise Analysis Capability
Analysis for EM Noise
EM Noise Origin and Path Analysis
Prevent for EM Noise
Preemptive Measures for Noise Reduction
Optimize Return Path
Current Return Path Optimization
Shielding Analysis
Shielding Material and Structure Efficiency Analysis
PI: Power Distribution Network Analysis
Power Noise Analysis
Power Distribution Network Noise and Impedance Analysis
Power & Ground Plane Design
Power/Ground Plane Optimal Design
Decrease EMI Level
EMI Emission Suppression from Power Noise
SI: High-Speed Signal Transmission Analysis
SSN Mode Analysis
Simultaneous Switching Noise Simulation
Eye Diagram Verification
Signal Quality (Jitter, Margin) Analysis
PCB
Introducing our core competencies for high-quality design and PCB design portfolio.
Quality Assurance
PCB Design Strength
Core Competencies for High-Quality Design
Placement & Routing Optimization
Our designs prioritize signal integrity and power stability.
- EMI/EMC Noise Reduction Design
- PDN (Power Delivery Network) Stabilization
- Thermal-Aware Component Placement & Heat Dissipation
Precision Impedance Control
We have precise impedance matching expertise for high-speed signal transmission.
- Single: 40Ω, 45Ω, 50Ω Precision Control
- Diff: 85Ω, 90Ω, 95Ω, 100Ω Matching
- Trace Width Optimization via Stackup Simulation
High-Density Mounting Expertise
We achieve product miniaturization through optimal component placement and routing in limited space.
- HDI (High Density Interconnect) Design
- Fine Pitch BGA & CSP Mounting
- 3-Stage Stack-up & Build-up Design Experience
Quality Gate Operations
We minimize design errors and assure quality through thorough internal verification procedures.
- Full Inspection via Internal Checklist
- DFM (Design for Manufacturing) Review
- Human Error Prevention via Cross-Check
Portfolio
PCB Design Portfolio
Power Cabinet Controller for Power Plants
Minimizing signal interference through 1-6 layer routing design
Meeting industrial environment reliability (heat/seismic) requirements
Vehicle BMS
Power Plane Design for High Current (2oz Copper) Handling
Separation of Analog Sensing Signals and Digital Control
AI FPGA Design
I-TERA Material Application for High-performance AI Computing
Mobile Feasibility Design
HDI Method for 0.6T Ultra-thin Design
RF, Logic M.2 Design
Miniaturization Design Conforming to M.2 Form Factor Specifications
Design Value
PCB Design Competitiveness & Value
High-Density Design Product Miniaturization and Weight Reduction
SI / PI Analysis Precision analysis for impedance control and signal integrity
Noise Reduction Optimal pattern design and ground handling to minimize EMC/EMI issues
Productivity Optimization: Component placement and routing optimized for mass production
Multi-layer / HDI Design
High-Density DesignImpedance Control
SI / PI AnalysisHigh-Speed Signal Design
Noise ReductionDFM / DFT Compliance
Productivity OptimizationSMT
High-quality PCB assembly through state-of-the-art equipment and precision process control.
SMT (Surface Mount Technology)
High-quality PCB assembly through state-of-the-art equipment and precision process control.
- BGA 0.35P / 0201 Mounting
- 800x400mm Large Board Support
- Full-line 3D SPI & N2 Reflow
- IATF 16949 Certified Process
- IPC-A-610 Class 3 (CIS)
- AOI · X-Ray · MSD Precision Management
Technical support for critical module supply in high-reliability industries
SMT Material Purchasing & Warehouse Management
Purchasing Process (SOP)
Temperature & Humidity Precision Monitoring
Component Management & Traceability
Real-time monitoring of material flow and inventory status
via ERP system
Immediate isolation and replacement
via Lot No. tracking when issues occur